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Application Datasheets

Brochures & Product Datasheets

Solstice Single-Wafer Processing Platform

White Papers

End Point Detection When Wet Processing Compound Semiconductor Substrates

Articles & Viewpoints

Industry Observation: Indium Plating Challenges Unlocked (July 2023)

Case Study: Unconventional Electroplating for Performance (December 2022)

Moving away from silicon’s cast-offs (May 2022)

Electroplating innovation enables ultrafine indium bonding (July 2022)

Silicon Semiconductor plating article — Si Semi Electroplating Article

Silicon Semiconductor article on gold plating — Si Semi Gold Savings Article

Plating presentation from SEMICON West — SEMICON Presentation

Solstice electroplating magazine ad — Introducing Solstice electroplating

Solstice electroplating ad — Solstice – the total package

Article by Byron Exarcos in Solid State Technology — Solid State Technology Article

Videos

Technology Papers

Advanced Semiconductor Plating – Key Fundamentals
Process Application Note #100 – This paper provides background fundamentals of electrochemical deposition (ECD) in the semiconductor industry for engineers, technicians, and other personnel involved in plating processes. See Summary Overview

Electroplating Fundamentals – Optimizing Cross-wafer
Process Application Note #101 – This paper presents the basic principles and methodologies for helping process engineers to achieve optimized cross-wafer uniformity in semiconductor electroplating. It provides guidance for users of different plating systems. See Summary Overview