Systems Designed for Advanced Microelectronics Markets

ClassOne’s Solstice is a great match for the advanced packaging market. From market leaders to new entrants in Europe and Asia, ClassOne serves these customers with its highly flexible Solstice platform. Combining advanced high-performance plating and surface-prep chambers allows both high-volume and specialty/niche packaging partners to process wafers. Our customers continue to advance processes in pillar, TSV, RDL, interposer and other emerging interconnect technologies such as hybrid bonding.

From VCSEL sensors to advanced AI communication chips, Solstice serves the photonics market. In handling fragile indium phosphide (InP) and gallium nitride (GaN) wafers, Solstice uses automation that can easily adapt to different wafer sizes and types. Additionally Solstice takes advanced process technology that is usually only available for large wafer types (300mm) and scales it down effectively to 3-, 4-, 6-, and 8-inch wafers. With AI data centers continuing to increase, the need for fast, low-latency, high-bandwidth data communication shows no sign of abating, heightening the need for Solstice’s proven performance.

In AI, indium phosphide (InP)-based photonic transceiver technology is needed to build bigger and better AI data centers. Connecting thousands of GPUs for large neural net training batches requires fiber-optic technology and advanced transceivers to transfer data effectively. Solstice’s ability to handle 3-, 4-, and 6-inch Indium Phosphide (InP) wafers and provide advanced, fully automated processing sets it apart in the marketplace. Additionally, Solstice’s class-leading gold plating and metal lift-off process (MLO) technology gives fabs the ultimate value in metallization.

MEMS device makers appreciate ClassOne’s Solstice for its flexibility and capability in diverse processing applications. As a variety of product types continue to be introduced to support IoT and smart devices, fabs need a tool that can be easily modified to support new wafers and processes. ClassOne’s modular tool design and flexible design orientation gives it unmatched capability to support customers in this segment.

In RF and power, Solstice’s capability to provide high-volume gold-plating processes is widely leveraged. Device makers in this segment appreciate the system’s elegant design, which makes it easier to service and faster to dial-in uniformity. All of this is enabled without sacrificing performance or operating costs. The Solstice tool uses an advanced fountain plater design with in situ rinse to preserve bath chemistry and give customers uncompromised cost and performance.