Solstice®
Gen4 Chamber™
Advanced Electroplating Performance for a Wide Range of Metals, Solders and Alloys:
- Nickel
- Tin
- Tin-silver
- Nickel-iron
- Gold-tin
- Palladium-cobalt
- Palladium-nickel
- Fine-grain indium
- And more
No compromise. Plating rate and uniformity performance results.
Leading manufacturers of GaAs and GaN devices are choosing Solstice GoldPro as their plating technology for applications from RF to VCSELs and microLEDs.
Our Solstice® GoldPro™ electrochemical deposition plating chambers are designed to deliver efficiency, speed, and improved cost of ownership to your process. The chamber leverages our proprietary fluid flow and electric field shaping technology to give you high plating rates and uniform depositions every time.
In addition, plating chambers can be supplied with chemistry via individual tanks or shared tanks. Nitrogen protection is offered in the bath and in the plating chamber to maximize sulfite bath life. Our GoldPro technology is further differentiated by its ability to plate highly uniform features without the added maintenance complexity of submerged agitators.
Features
- Advanced fluidics and electric field control
- Nitrogen bath life protection
- Closed loop bath control
- Automated and programmable dosing
| Performance | GoldPro |
|---|---|
| Within Feature Uniformity | <1.5% |
| Within Die Uniformity | <1% |
| Within-Wafer Uniformity | <3% |
| Wafer-to-Wafer Uniformity | <4% |
| Step Coverage | >90% |
| Feature Size | <1 micron wide |
| Plating Overburden | <1 micron |
The Gen4 chamber incorporates ClassOne’s electroplating expertise to deliver the process control and uniformity required for demanding semiconductor manufacturing applications.
Core Capabilities
- Precision electric field control
- Wide process operating window
- Uniform current distribution
- High-quality deposition performance
- Excellent wafer-to-wafer repeatability
- Flexible recipe architecture
- In situ rinse
- Fully programmable power supply with pulsed option
- Computational fluid dynamics-designed
These capabilities enable customers to optimize plating performance while maintaining process consistency across development and production environments.
Talk to Our Process Experts
Whether you are developing next-generation advanced packaging technologies, photonics devices, MEMS structures, or specialty semiconductor applications, the Gen4™ Electroplating Chamber provides the flexibility and performance needed to accelerate process development and manufacturing success.
Key Benefits
- Broad chemistry compatibility
- Flexible process configuration
- Excellent wafer uniformity
- Advanced process control
- High-throughput operation
- Scalable from R&D to production
- Integrated with Solstice® wet processing technologies
Solstice® Gen4 Advanced Plating Chamber Overview
ClassOne Solstice Single-Wafer Platform for Advanced Packaging
