Solstice®
GoldPro™ Chamber
Key Applications
Leading manufacturers of GaAs and GaN devices are choosing Solstice GoldPro as their plating technology for applications from RF to VCSELs and microLEDs.
Our Solstice® GoldPro™ electrochemical deposition plating chambers are designed to deliver efficiency, speed, and improved cost of ownership to your process. The chamber leverages our proprietary fluid flow and electric field shaping technology to give you high plating rates and uniform depositions every time.
In addition, plating chambers can be supplied with chemistry via individual tanks or shared tanks. Nitrogen protection is offered in the bath and in the plating chamber to maximize sulfite bath life. Our GoldPro technology is further differentiated by its ability to plate highly uniform features without the added maintenance complexity of submerged agitators.
Solstice® GoldPro™ is the only gold plating chamber in the industry that is able to achieve a totally randomized fluid vector at the wafer surface without need for paddles or other complex mechanisms – delivering maximized plating rates and uniformity. It enables the deposition of thick or thin gold layers precisely, efficiently, and rapidly – many times faster than alternative deposition methods. It achieves the highest step coverage with excellent feature fill while minimizing defect and integration issues.
Features
- Advanced fluidics and electric field control
- Nitrogen bath life protection
- Closed loop bath control
- Automated and programmable dosing
| Performance | GoldPro |
|---|---|
| Within Feature Uniformity | <1.5% |
| Within Die Uniformity | <1% |
| Within-Wafer Uniformity | <3% |
| Wafer-to-Wafer Uniformity | <4% |
| Step Coverage | >90% |
| Feature Size | <1 micron wide |
| Plating Overburden | <1 micron |
Solstice® GoldPro™ Gold Electroplating Chamber Overview
