ClassOne Equipment Selected to Upgrade Major UK Fab
Atlanta, GA – February 27, 2018 – ClassOne Equipment, Atlanta-based provider of refurbished name-brand semiconductor processing equipment, has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab.
Read StoryClassOne Slashes Via Liner Plating Costs for Compound Semi
Kalispell, MT – November 21, 2017 – ClassOne Technology, manufacturer of Solstice® plating systems for ≤200mm wafers, announced a new plating technique that provides significant cost reductions for compound semiconductor manufacturers who use gold plated vias.
Read StoryNew Integrated Financing Streamlines Equipment Purchasing
Kalispell, MT – October 13, 2017 – ClassOne Group, provider of semiconductor processing systems, today announced a special new financing program that seeks to give more attractive options to equipment purchasers.
Read StoryClassOne select TFE as their representative in Southern Europe
Binasco – June 30, 2017 – TFE – Thin Film Equipment Srl and ClassOne Technology, Inc. have signed an agreement that allows TFE to exclusively represent ClassOne Technology, Inc products in Southern Europe and related countries.
Read StoryNew ClassOne Chamber Cuts Copper Plating Costs 95%
Kalispell, MT – March 8, 2017 – ClassOne Technology, manufacturer of budget-friendly Solstice® plating systems, announced it’s new CopperMax™ chamber — an innovative design that is demonstrating major copper plating cost reductions for users of ≤200mm wafers.
Read StoryClassOne Signs Scientech as Rep for China, Taiwan and SE Asia
Kalispell, MT – March 8, 2017 – ClassOne Technology, manufacturer of wet processing equipment for 200mm and smaller wafers, announced that Scientech Corporation of Taipei, Taiwan, will become the company’s new representative for China, Taiwan and Southeast Asia, starting immediately.
Read StoryClassOne Initiative Aims to Reduce CoO in ≤200mm Copper Plating
Kalispell, MT – February 22, 2017 – ClassOne Technology (www.classone.com), manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has just announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.
Read StoryClassOne Reports Record Sales, Crediting WLP and More than Moore
Kalispell, MT – December 6, 2016 – ClassOne Technology, manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand. “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt. “Most of these users are now focusing on capabilities they couldn’t get before, like wafer-level packaging and More than Moore technologies.”
Read StoryMurphy, Choh and Pilla Join ClassOne Technology’s Board of Advisors
Kalispell, MT – November 30, 2016 – ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
Read StoryClassOne Announces Major Savings with Solstice Gold Plating
Kalispell, MT – June, 1, 2016 – ClassOne Technology, manufacturer of budget-friendly wet processing equipment, is reporting significant savings in the plating of gold in ≤200mm applications using its Solstice® systems. The savings come from elimination of gold waste, faster and simpler processing, and innovative Solstice-enabled techniques that can substantially reduce gold usage.
Read StoryPress Contacts
For general media inquiries
please call +1 678 772 9086
Or email pr@classone.com