ClassOne Slashes Via Liner Plating Costs for Compound Semi

Kalispell, MT – November 21, 2017 – ClassOne Technology, manufacturer of Solstice® plating systems for ≤200mm wafers, announced a new plating technique that provides significant cost reductions for compound semiconductor manufacturers who use gold plated vias.

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New Integrated Financing Streamlines Equipment Purchasing

Kalispell, MT – October 13, 2017 – ClassOne Group, provider of semiconductor processing systems, today announced a special new financing program that seeks to give more attractive options to equipment purchasers.

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ClassOne select TFE as their representative in Southern Europe

Binasco – June 30, 2017 – TFE – Thin Film Equipment Srl and ClassOne Technology, Inc. have signed an agreement that allows TFE to exclusively represent ClassOne Technology, Inc products in Southern Europe and related countries.

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New ClassOne Chamber Cuts Copper Plating Costs 95%

Kalispell, MT – March 8, 2017 – ClassOne Technology, manufacturer of budget-friendly Solstice® plating systems, announced it’s new CopperMax™ chamber — an innovative design that is demonstrating major copper plating cost reductions for users of ≤200mm wafers.

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ClassOne Signs Scientech as Rep for China, Taiwan and SE Asia

Kalispell, MT – March 8, 2017 – ClassOne Technology, manufacturer of wet processing equipment for 200mm and smaller wafers, announced that Scientech Corporation of Taipei, Taiwan, will become the company’s new representative for China, Taiwan and Southeast Asia, starting immediately.

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ClassOne Initiative Aims to Reduce CoO in ≤200mm Copper Plating

Kalispell, MT – February 22, 2017 – ClassOne Technology (www.classone.com), manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has just announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

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ClassOne Reports Record Sales, Crediting WLP and More than Moore

Kalispell, MT – December 6, 2016 – ClassOne Technology, manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand. “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt. “Most of these users are now focusing on capabilities they couldn’t get before, like wafer-level packaging and More than Moore technologies.”

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Murphy, Choh and Pilla Join ClassOne Technology’s Board of Advisors

Kalispell, MT – November 30, 2016 – ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.

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ClassOne Announces Major Savings with Solstice Gold Plating

Kalispell, MT – June, 1, 2016 – ClassOne Technology, manufacturer of budget-friendly wet processing equipment, is reporting significant savings in the plating of gold in ≤200mm applications using its Solstice® systems. The savings come from elimination of gold waste, faster and simpler processing, and innovative Solstice-enabled techniques that can substantially reduce gold usage.

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New Funding Fuels ClassOne Technology’s 2016 Growth Surge

Kalispell, MT – April 11, 2016 ClassOne Technology (www.classone.com), manufacturer of cost-efficient Solstice® electroplating systems, has announced the completion of a major new round of funding from Salem Investment Partners of Winston-Salem, North Carolina. The announcement was made jointly by Byron Exarcos, CEO of ClassOne and Meredith Jolly, Vice President at Salem Investment Partners.

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