Solstice^®
CopperMax™ Chamber

Leading manufacturers are choosing Solstice CopperMax as their plating technology for through-silicon via (TSV), through-glass via (TGV), damascene and copper pillar features.

Our Solstice^® CopperMax^™ chamber is designed to deliver high-performance copper plating at a low cost of ownership. Capable of plating a wide variety of feature types, the CopperMax chamber uses a cationic exchange membrane to protect additives from premature degradation at the anode. This results in 90%+ savings in bath additive costs.

The CopperMax chamber design enables the use of much less expensive bulk copper pellets instead of the usual solid-machined copper anodes, reducing anode costs by over 50%.

In addition, CopperMax uses our proprietary fluid flow and electric field shaping technology to achieve high plating rates and uniform deposition. With the ability to deposit film with optimal grain orientation, our Solstice platform has been selected for emerging applications such as hybrid bonding and advanced packaging.

Solstice^® CopperMax™ delivers consistently higher-quality, higher-rate copper plating, while maximizing uptime and performance — significantly reducing cost of ownership. Improve the performance of your copper process with Solstice^® CopperMax™.