High-Performance Single-Wafer Solutions

The Solstice platform provides a common, easy-to-use, high-performance flexible platform for many process technologies across electroplating and wet surface preparation processes.

Advanced Packaging

Eliminate Plating Variability in Advanced Packaging

Solstice delivers high-throughput, cost-effective electroplating tailored for advanced packaging applications — perfect for redistribution layers, under-bump metallization, and microbumps.

Advanced Gold Plating

Achieve Reliable Gold Deposition Without Process Drift

Solstice’s precision gold electroplating ensures uniform thickness, purity, and adhesion—addressing common challenges in RF, MEMS and sensors, and high-reliability device manufacturing.

Solvent Processing

Solve Lift-Off and
Resist-Removal Bottlenecks

Solstice’s advanced solvent processing removes stubborn resists and lift-off materials quickly and safely, reducing process variability, chemical exposure risks, and cycle times.

Wet Etch and Cleans

Remove Seed Layers Without Damaging What Matters

Solstice’s highly controlled single-wafer etch processes eliminate residual seed and barrier metals while protecting delicate structures and preventing costly device defects.

Emerging technologies

Bridge the Gap Between R&D and High-Volume Manufacturing

Flexible, configurable Solstice platforms accelerate development and scaling of new semiconductor technologies without sacrificing repeatability, integration, or manufacturing readiness.

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Let’s Talk

We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.

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ClassOne Technology Inc.

109 Cooperative Way

Kalispell, Montana, 59901

United States

+1 406 407 7814