• Products
    • Solstice Max (200/300mm) 
    • Solstice S-Series (≤200mm)
  • Technologies
    • Advanced Packaging
      • Copper TSV Fill Plating
      • Copper RDL Plating
      • Copper Pillar Plating
      • Multi Metal Stack Pillar
    • Advanced Gold Plating
      • Fine Feature Gold Fill
      • Gold Deplating
      • Gold TWV Plating
      • Patterned Gold Plating
    • Solvent Processing
      • Photoresist Strip Process
      • Metal Lift-Off (MLO)
    • Wet Etch and Cleans
      • UBM and Patterned Metal Wet Etch
      • RCA Cleans (SC1/SC2)
      • Piranha (SPM)
    • Emerging Technologies
      • TGVs (Through Glass Vias) and Glass Interposers
      • Indium Bump Plating
      • Hybrid Bonding
  • Process Chambers
    • Electroplating
      • GoldPro™ Chamber
      • CopperMax™ Chamber
      • Gen4 ECD Chamber
    • Surface Preparation
      • Wet Etch Chamber  
      • Solvent & MLO Chamber
  • Markets
  • Resources
  • Company
    • About Us
    • News
    • Contact Us
  • Products
    • Solstice Max (200/300mm) 
    • Solstice S-Series (≤200mm)
  • Technologies
    • Advanced Packaging
      • Copper TSV Fill Plating
      • Copper RDL Plating
      • Copper Pillar Plating
      • Multi Metal Stack Pillar
    • Advanced Gold Plating
      • Fine Feature Gold Fill
      • Gold Deplating
      • Gold TWV Plating
      • Patterned Gold Plating
    • Solvent Processing
      • Photoresist Strip Process
      • Metal Lift-Off (MLO)
    • Wet Etch and Cleans
      • UBM and Patterned Metal Wet Etch
      • RCA Cleans (SC1/SC2)
      • Piranha (SPM)
    • Emerging Technologies
      • TGVs (Through Glass Vias) and Glass Interposers
      • Indium Bump Plating
      • Hybrid Bonding
  • Process Chambers
    • Electroplating
      • GoldPro™ Chamber
      • CopperMax™ Chamber
      • Gen4 ECD Chamber
    • Surface Preparation
      • Wet Etch Chamber  
      • Solvent & MLO Chamber
  • Markets
  • Resources
  • Company
    • About Us
    • News
    • Contact Us
ClassOne Solstice electroplating operator
Wafer handling inside Solstice S8 plating system
Operator in front of Solstice S8 system
Solstice S8 electroplating system
Technician servicing Solstice S8 plating system

Let’s Talk

We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.

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  • Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
  • Process Chambers
    • GoldPro™ Chamber
    • CopperMax™ Chamber
    • Gen4 ECD Chamber
    • Wet Etch Chamber
    • Solvent & MLO Chamber
  • Markets
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us

ClassOne Technology Inc.

109 Cooperative Way

Kalispell, Montana, 59901

United States

+1 406 407 7814