• Products
    • Solstice Max (200/300mm) 
    • Solstice S-Series (≤200mm)
  • Technologies
    • Advanced Packaging
      • Copper TSV Fill Plating
      • Copper RDL Plating
      • Copper Pillar Plating
      • Multi Metal Stack Pillar
    • Advanced Gold Plating
      • Fine Feature Gold Fill
      • Gold Deplating
      • Gold TWV Plating
      • Patterned Gold Plating
    • Solvent Processing
      • Photoresist Strip Process
      • Metal Lift-Off (MLO)
    • Wet Etch and Cleans
      • UBM and Patterned Metal Wet Etch
      • RCA Cleans (SC1/SC2)
      • Piranha (SPM)
    • Emerging Technologies
      • TGVs (Through Glass Vias) and Glass Interposers
      • Indium Bump Plating
      • Hybrid Bonding
  • Process Chambers
    • Electroplating
      • GoldPro™ Chamber
      • CopperMax™ Chamber
      • Gen4 ECD Chamber
    • Surface Preparation
      • Wet Etch Chamber  
      • Solvent & MLO Chamber
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    • About Us
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  • Products
    • Solstice Max (200/300mm) 
    • Solstice S-Series (≤200mm)
  • Technologies
    • Advanced Packaging
      • Copper TSV Fill Plating
      • Copper RDL Plating
      • Copper Pillar Plating
      • Multi Metal Stack Pillar
    • Advanced Gold Plating
      • Fine Feature Gold Fill
      • Gold Deplating
      • Gold TWV Plating
      • Patterned Gold Plating
    • Solvent Processing
      • Photoresist Strip Process
      • Metal Lift-Off (MLO)
    • Wet Etch and Cleans
      • UBM and Patterned Metal Wet Etch
      • RCA Cleans (SC1/SC2)
      • Piranha (SPM)
    • Emerging Technologies
      • TGVs (Through Glass Vias) and Glass Interposers
      • Indium Bump Plating
      • Hybrid Bonding
  • Process Chambers
    • Electroplating
      • GoldPro™ Chamber
      • CopperMax™ Chamber
      • Gen4 ECD Chamber
    • Surface Preparation
      • Wet Etch Chamber  
      • Solvent & MLO Chamber
  • Markets
  • Resources
  • Company
    • About Us
    • News
    • Contact Us

Solstice S8

Advanced single-wafer electroplating and surface preparation, with up to eight chambers

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Key Benefits

High plating rates, excellent throughput

Exceptional quality plating and surface prep

Special processing chambers can substantially reduce plating costs

Superior process control and excellent uniformity

Dimensions

Advanced single-wafer electroplating and surface preparation, with up to eight chambers

The Solstice® S8 is the most powerful, easy-to-use, and costefficient route to single-wafer volume production for many applications.

The S8 is engineered to deliver class-leading performance and exceptional operational flexibility. Its unique platform enables it to handle a spectrum of wet processes, from electroplating to high-pressure metal lift-off (MLO) to UBM etch and much more. The system is designed to accommodate many different substrate types, both transparent and opaque, from ultra thin to bonded. With its ability to deliver high-quality plating of a wide range of metals, the Solstice S8 can significantly reduce plating costs.

Solstice gives wet bench users an attractive, affordable, and easy upgrade path to the benefits of high-speed, cassetteto-cassette automated processing.

The eight chambers of this system may be configured with a mix of different plating and surface prep chambers: GoldPro, CopperMax, Wet Etch, Solvent/MLO, Bevel Etch, and Gen4 Chamber.

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Let’s Talk

We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.

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  • Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
  • Process Chambers
    • GoldPro™ Chamber
    • CopperMax™ Chamber
    • Gen4 ECD Chamber
    • Wet Etch Chamber
    • Solvent & MLO Chamber
  • Markets
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us

ClassOne Technology Inc.

109 Cooperative Way

Kalispell, Montana, 59901

United States

+1 406 407 7814