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  • Products
    • Solstice Max (200/300mm) 
    • Solstice S-Series (≤200mm)
  • Technologies
    • Advanced Packaging
      • Copper TSV Fill Plating
      • Copper RDL Plating
      • Copper Pillar Plating
      • Multi Metal Stack Pillar
    • Advanced Gold Plating
      • Fine Feature Gold Fill
      • Gold Deplating
      • Gold TWV Plating
      • Patterned Gold Plating
    • Solvent Processing
      • Photoresist Strip Process
      • Metal Lift-Off (MLO)
    • Wet Etch and Cleans
      • UBM and Patterned Metal Wet Etch
      • RCA Cleans (SC1/SC2)
      • Piranha (SPM)
    • Emerging Technologies
      • TGVs (Through Glass Vias) and Glass Interposers
      • Indium Bump Plating
      • Hybrid Bonding
  • Process Chambers
    • Electroplating
      • GoldPro™ Chamber
      • CopperMax™ Chamber
      • Gen4 ECD Chamber
    • Surface Preparation
      • Wet Etch Chamber  
      • Solvent & MLO Chamber
  • Markets
  • Resources
  • Company
    • About Us
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    • Contact Us

Solstice M4

Fully automated single wafer  ≤ 300mm processing in a compact footprint

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Key Benefits

M4 provides automated ECD and SP processing 

M4 allows for all Solstice chamber solutions to be configured 

Fully extendable to M8/M12/M16 in the future

M4 can be configured with a 5th position for support chambers 

Dimensions

M4 configured with Single Load Port and 5th Support Chamber Position

M4 configured with EFEM


Fully automated single wafer ≤ 300mm processing in a compact footprint

The Solstice M4 system makes use of a single 4 chamber frame. It can be configured with a full EFEM for multiple cassette or FOUP load ports or a single load port. Configured with the single load port, the M4 system provides an unprecedented, compact tool for fully automated processing. This M4 can be used for a full bumping process (prewet/SRD, copper, nickel, tin silver) or other plating and surface prep processes. A fifth chamber can be added for increased capability, and it can be removed or repositioned when the the tool is extended to an M8/M12/M16.

The M4’s frame uses integrated adjacent electrical pods that allow for easy repair and maintenance. A single radial robot with dual end effectors allows for efficient wafer automation between FOUP or cassette and chambers. Additionally, an easily accessed fluidics bay below each pair of chambers contains all the wetted components like tanks, pumps, filters, heaters, and valves in a maintainable layout. Facilities can be adapted for “out-the-side” or “out-the-bottom” fabs.

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Let’s Talk

We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.

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  • Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
  • Process Chambers
    • GoldPro™ Chamber
    • CopperMax™ Chamber
    • Gen4 ECD Chamber
    • Wet Etch Chamber
    • Solvent & MLO Chamber
  • Markets
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us

ClassOne Technology Inc.

109 Cooperative Way

Kalispell, Montana, 59901

United States

+1 406 407 7814