Electroplating and Wet Processing for Advanced Microelectronics
High Performance, Superior Uniformity,
and Flexible Configurations At The Industry’s Best Price-To-
Performance Ratio
Get Solstice
Solstice® Single-Wafer Wet Processing
Max Series
- Modular platform, extendible in the field
- 200mm and 300mm wafer capable
- From 2 to 16 chambers
S-Series
- Monolithic frame
- 3-inch to 200mm wafer capable
- From 2 to 8 chambers
- Smallest footprint
One platform, two paths
ClassOne’s Solstice® platform delivers advanced single-wafer electroplating and wet processing for semiconductor and compound semiconductor manufacturing, empowering fabs with high throughput, superior wafer uniformity, and flexible configurations for a broad range of device types and process needs.
Built from the ground up for optimal performance and ease of use, Solstice integrates advanced plating and wet process chambers with automation to enable seamless gold, copper, and specialty metal deposition, lift-off, cleaning, and etch. Key markets include advanced packaging, photonics, artificial intelligence (AI), MEMS and sensors, RF, and power devices.
Trusted by volume production fabs, R&D facilities, and universities worldwide, our flagship Solstice technology is available in two versions: Solstice S-Series and Solstice Max Series.
200/300 mm
wafers
2 – 16
simultaneous
chambers
The Max Series
The Max Series extends the Solstice platform to accommodate 200mm and 300mm wafers. Able to run both wafer sizes simultaneously in different chambers (from 2 up to 16), the Max Series enables extraordinary flexibility for process expansion and volume ramps. Designed with more compact dimensions than competitive wet processing systems, the Max System fits into a wider range of cleanroom sizes.
75-200 mm
wafers
2, 4, 8
chambers
The S-Series
The S-Series performs plating, etching and cleaning of product wafers ranging from 75mm to 200mm in diameter. The flexible platform can be configured with 2, 4 or 8 chambers on a monolithic frame that offers the industry’s smallest footprint for advanced single-wafer plating and wet processing tools.
