Technical Articles

ClassOne Trident Spin-Rinse Dryer (SRD)

Procedure to Optimize Performance of Your Spin Rinse Dryer (SRD)

It is important to follow this typical procedure (recipe) to optimize the performance of your Spin Rinse Dryer (SRD) and to ensure a clean product…

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Trident Metal Liftoff Process

Trident SST for Metal Lift-Off Process

Inexpensively patterning metal for the fabrication of micro-devices such as MEMs, sensors, LEDs, and photonics (to name a few) is a nearly universal, but fundamental process. A common and effective method is to deposit a blanket layer of metal over a patterned release layer such as photoresist. By relying on the adhesion of the metal to the substrate, the dissolution of the underlying resist releases the unwanted metal leaving islands of patterned metal behind.

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ClassOne Technology

Wafer Level Packaging

ClassOne Technology designs and builds the Solstice Automated Plating Tool for several semiconductor process steps of the wafer-level packaging process that includes, Cu Plating, Cu RDL, Cu Pillar Plating, Cu Bump Plating, Barrier Plating, and various type of lead-free Solder Plating.

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CU Pillar Process

Solstice Plating Tool for Cu Plating (Cu RDL, Cu Bumps, Cu Pillars)

ClassOne Technology designs and builds the Solstice Plating System for several semiconductor process steps of the wafer-level packaging process that includes, Cu Plating, Cu RDL, Cu Pillar Plating, Cu Bump Plating, Barrier Plating, and various type of lead-free Solder Plating.

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