Solstice SP8
Automated Surface Prep Systems
Advanced, single-wafer, high-throughput Surface Preparation and ECD – with up to eight chambers
Eight chambers – maximum throughput and flexibility
The Solstice® SP8 automated single-wafer systems are high-speed, fully-automated, 8-chambered tools designed for surface preparation wet processing – as well as electrochemical deposition (ECD) – specifically for ≤200mm wafers. This tool is a powerful, easy-to-use, and cost-efficient route to volume production for many applications.
The SP8 is engineered to deliver class-leading performance and exceptional operational ease and flexibility. Its unique platform enables it to handle a spectrum of surface preparation processes, from high-pressure metal lift-off to UBM etch and a great deal more.
The tool readily accommodates a broad range of substrate types, both transparent and opaque, from very thin to bonded.
Speed, uniformity, and control
Solstice gives wet bench users an attractive, affordable, and easy upgrade path to the benefits of high-speed, cassette-to-cassette automated processing – along with major improvements in quality, consistency, throughput, safety, and control.
This system may be configured with a mix of up to eight different surface prep chambers, specified at the time of purchase. The configuration may also include electroplating chambers as needed to address user applications.
All Solstice models share the same innovative high-performance chambers, software controls, and electronics. Each tool also provides the same intuitive touch-screen control, with GEM/SECSII interface, full reporting, and much more.
See also:
KEY FEATURES
- Eight chambers to enable many functions
- Configurable for surface prep and electroplating on a single tool
- Handles 75mm to 200mm substrates
- Enables rapid diameter changes
- Handles thin or bonded, transparent or opaque substrates
- Covers very wide range of surface preparation processes
MAJOR BENEFITS
- High processing rates, excellent throughput
- Exceptional quality surface prep and plating
- Special processing chambers can substantially reduce costs
- Superior process control and excellent uniformity
Eight chambers – maximum throughput and flexibility
The Solstice® SP8 automated single-wafer systems are high-speed, fully-automated, 8-chambered tools designed for surface preparation wet processing – as well as electrochemical deposition (ECD) – specifically for ≤200mm wafers. This tool is a powerful, easy-to-use, and cost-efficient route to volume production for many applications.
The SP8 is engineered to deliver class-leading performance and exceptional operational ease and flexibility. Its unique platform enables it to handle a spectrum of surface preparation processes, from high-pressure metal lift-off to UBM etch and a great deal more.
The tool readily accommodates a broad range of substrate types, both transparent and opaque, from very thin to bonded.
Speed, uniformity, and control
Solstice gives wet bench users an attractive, affordable, and easy upgrade path to the benefits of high-speed, cassette-to-cassette automated processing – along with major improvements in quality, consistency, throughput, safety, and control.
This system may be configured with a mix of up to eight different surface prep chambers, specified at the time of purchase. The configuration may also include electroplating chambers as needed to address user applications.
All Solstice models share the same innovative high-performance chambers, software controls, and electronics. Each tool also provides the same intuitive touch-screen control, with GEM/SECSII interface, full reporting, and much more.
