High-Performance Single-Wafer Solutions

Solstice delivers high-throughput, cost-effective electroplating tailored for advanced packaging applications — perfect for redistribution layers, under-bump metallization, and microbumps.

Solstice’s single-wafer wet etch capabilities offer precise, uniform seed and barrier layer removal.

Solstice supports precision solvent processes like photoresist strip and metal lift-off with faster, safer and cleaner single wafer process design.

With advanced single-wafer cleans, Solstice efficiently removes post-etch residues and contamination — critical for yield in compound and power devices.

Solstice enables uniform, high-purity gold plating with tight uniformity and high step coverage — optimized for RF, sensor, and high-reliability applications.

From photonics to advanced sensors, Solstice’s configurable platform adapts quickly to new processes—accelerating development without sacrificing performance.