Through Mask Gold Plating
Using the Solstice® GoldPro™ Chamber
Gold plating continues to be the standard for high-performance end applications such as aerospace and defense. Solstice excels in gold plating because of its advanced fountain-plater design. Fluid and electric profile modeling have allowed ClassOne to elegantly and simply plate gold uniformly across wafers, while in situ rinse ensures that gold chemistry is not lost or messily distributed across the tool.
Benefits:
- High plating rate and high uniformity
- Extremely uniform field profile
- Maximized bath life
- Seal reach aligns to existing integration
- Continuously cleaner chemistry
- Precise, consistent flow rate control
Technical Data:
| Plating Rate | Up to 1μm/minute (depend on chemistry) |
| Within-Wafer Uniformity | <2% |
| Within Feature Uniformity | <2% |
| Roughness | <2kA |
Gold plating continues to be the standard for high-performance end applications such as aerospace and defense. Solstice excels in gold plating because of its advanced fountain-plater design. Fluid and electric profile modeling have allowed ClassOne to elegantly and simply plate gold uniformly across wafers, while in situ rinse ensures that gold chemistry is not lost or messily distributed across the tool.
Benefits:
- High plating rate and high uniformity
- Extremely uniform field profile
- Maximized bath life
- Seal reach aligns to existing integration
- Continuously cleaner chemistry
- Precise, consistent flow rate control
Technical Data:
| Plating Rate | Up to 1μm/minute (depend on chemistry) |
| Within-Wafer Uniformity | <2% |
| Within Feature Uniformity | <2% |
| Roughness | <2kA |
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