Advanced Packaging
Solstice succeeds in providing high-value electroplating and support processes for advanced packaging and other back-end applications. Using a proven, high-performance, fountain-style plating chamber design, combined with elegant wet processing chambers such as vacuum pre-wet and wet etch, Solstice customers can efficiently and cost-effectively run a range of packaging processes, including bumping, pillar, and multi-metal stacks.
Supported ClassOne process chambers include:
