Hybrid Bonding

 

 

Hybrid bonding continues to be an end goal for advanced packaging, enabled by dense, uniform pillar and via structures. Coplanarity, metal grain orientation, and surface cleans can be successfully optimized using Solstice. ClassOne continues to work with select partners across the advanced packaging space to bring hybrid bonding technology to maturity.

Hybrid bonding continues to be an end goal for advanced packaging, enabled by dense, uniform pillar and via structures. Coplanarity, metal grain orientation, and surface cleans can be successfully optimized using Solstice. ClassOne continues to work with select partners across the advanced packaging space to bring hybrid bonding technology to maturity.

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We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.

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ClassOne Technology Inc.

109 Cooperative Way

Kalispell, Montana, 59901

United States

+1 406 407 7814