RCA Cleans (SC1/SC2)

 

 

Solstice uses face-down process technology for fast, clean wafer processing. Direct impingement of the full wafer surface provides uniform and consistent chemical coverage at all radial positions. Configurable fluidics allow for single use and efficient reclaim capability.

Solstice uses face-down process technology for fast, clean wafer processing. Direct impingement of the full wafer surface provides uniform and consistent chemical coverage at all radial positions. Configurable fluidics allow for single use and efficient reclaim capability.

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ClassOne Technology Inc.

109 Cooperative Way

Kalispell, Montana, 59901

United States

+1 406 407 7814