Multi Metal Stack Pillar

Solstice’s ultimate flexibility, with many electroplating and support chambers, allows it to be built for efficient multi-metal stacks. Commonly, copper-nickel-tin/silver plating can be done using the automated method. Vacuum prewet and/or chemical prewet can be easily implemented, along with clean and efficient intermetal rinses. Dedicated chambers and rotors ensure simple operation with no bath contamination or drag-out.

Benefits:

Multilayer metal bumps
Example: Cu-Ni-SnAg and Cu-Ni-Au.
Automated intermetal wafer rinses
Advanced scheduler for optimized tool throughput
Vacuum Pre-Wet (VPW) for High Aspect Ratio Wetting

Technical Data

Within-Wafer Uniformity	<5%
Wafer-to-Wafer Uniformity	<1%
Fill Quality	Void-free

Benefits:

Multilayer metal bumps
Example: Cu-Ni-SnAg and Cu-Ni-Au.
Automated intermetal wafer rinses
Advanced scheduler for optimized tool throughput
Vacuum Pre-Wet (VPW) for High Aspect Ratio Wetting

Technical Data

Within-Wafer Uniformity	<5%
Wafer-to-Wafer Uniformity	<1%
Fill Quality	Void-free