Gold Deplating
Benefits:
- Extremely uniform removal
- Optimal, responsive removal rate
- Extremely uniform field profile
- Contact reach aligns to existing integration
- Accurate, precise flow rate control
Technical Data:
| Within-Wafer Uniformity | <2% |
| Within Feature Uniformity | <2% |
| Roughness | 3A Ra |
Benefits:
- Extremely uniform removal
- Optimal, responsive removal rate
- Extremely uniform field profile
- Contact reach aligns to existing integration
- Accurate, precise flow rate control
Technical Data:
| Within-Wafer Uniformity | <2% |
| Within Feature Uniformity | <2% |
| Roughness | 3A Ra |
Let’s Talk
We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.