Fine Feature Gold Fill

Gold plating continues to be the standard for high-performance end applications such as aerospace and defense. Solstice excels in gold plating because of its advanced fountain-plater design. Fluid and electric profile modeling have allowed ClassOne to elegantly and simply plate gold uniformly across wafers, while in situ rinse ensures that gold chemistry is not lost or messily distributed across the tool.

Benefits:

High plating rate and high uniformity
Extremely uniform field profile
Maximized bath life
Seal reach aligns to existing integration
Continuously cleaner chemistry
Precise, consistent flow rate control

Technical Data:

Plating Rate	Up to 0.5/minute (depend on chemistry and feature size)
Within-Wafer Uniformity	<2%
Within Feature Uniformity	<2%
Wafer-to-Wafer Uniformity	<2%
Step Coverage	70-93% (depend on aspect ratio)
Roughness	<2kA

Benefits:

High plating rate and high uniformity
Extremely uniform field profile
Maximized bath life
Seal reach aligns to existing integration
Continuously cleaner chemistry
Precise, consistent flow rate control

Technical Data:

Plating Rate	Up to 0.5/minute (depend on chemistry and feature size)
Within-Wafer Uniformity	<2%
Within Feature Uniformity	<2%
Wafer-to-Wafer Uniformity	<2%
Step Coverage	70-93% (depend on aspect ratio)
Roughness	<2kA