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  • Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
    • Advanced Packaging
      • Copper TSV Fill Plating
      • Copper RDL Plating
      • Copper Pillar Plating
      • Multi Metal Stack Pillar
    • Seed And Barrier Etch
      • UBM and Patterned Metal Wet Etch
    • Solvent Processing
      • Photoresist Strip Process
      • Metal Lift-Off (MLO)
    • Back End Cleans
      • RCA Cleans (SC1/SC2)
      • Piranha (SPM)
    • Advanced Gold Plating
      • Fine Feature Gold Fill
      • Gold Deplating
      • Gold TWV Plating
      • Through Mask Gold Plating
    • Emerging Technologies
      • TGVs
      • Indium Bump Plating
      • Hybrid Bonding
      • Glass Interposers
  • Markets
    • Advanced Packaging
    • Photonics
    • Artificial Intelligence
    • MEMS and Sensors
    • RF & Power Devices
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us

Solstice S4

Advanced, single-wafer, high-throughput ECD and surface preparation, with up to four chambers

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Key Benefits

Smaller footprint and lower cost than Solstice S8

High plating rates, excellent throughput

Exceptional quality plating and surface prep

Special processing chambers can substantially reduce
plating costs

Superior process control and excellent uniformity

Dimensions


Advanced, single-wafer, high-throughput ECD and surface preparation, with up to four chambers

The Solstice® S4 automated electroplating systems are high-speed, fully -automated, 4-chamber tool designed for electroplating as well as surface preparation wet processing. The S4 provides all the essential features and capabilities of the S8, but with fewer chambers, a smaller footprint, and a lower price. The S4 can be ideal for users with simpler processing needs or who require an economical entry point into mid-level automated single-wafer electroplating production with enhanced process control.

The Solstice S4’s four chambers may be configured with a mix of different plating and surface prep chambers: GoldPro, CopperMax, Wet Etch, Solvent/MLO, Bevel Etch, and Gen4 Chamber.

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Let’s Talk

We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.

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  • Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
  • Markets
    • Advanced Packaging
    • Photonics
    • Artificial Intelligence
    • MEMS and Sensors
    • RF & Power Devices
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us

ClassOne Technology Inc.

109 Cooperative Way

Kalispell, Montana, 59901

United States

+1 406 407 7814