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  • Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
    • Advanced Packaging
      • Copper TSV Fill Plating
      • Copper RDL Plating
      • Copper Pillar Plating
      • Multi Metal Stack Pillar
    • Seed And Barrier Etch
      • UBM and Patterned Metal Wet Etch
    • Solvent Processing
      • Photoresist Strip Process
      • Metal Lift-Off (MLO)
    • Back End Cleans
      • RCA Cleans (SC1/SC2)
      • Piranha (SPM)
    • Advanced Gold Plating
      • Fine Feature Gold Fill
      • Gold Deplating
      • Gold TWV Plating
      • Through Mask Gold Plating
    • Emerging Technologies
      • TGVs
      • Indium Bump Plating
      • Hybrid Bonding
      • Glass Interposers
  • Markets
    • Advanced Packaging
    • Photonics
    • Artificial Intelligence
    • MEMS and Sensors
    • RF & Power Devices
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us

Solstice LT

Semi-automated single-wafer process development with up to three chambers

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Key Benefits

Up to 3 chambers: 2 ECD, or 2 ECD plus 1 vacuum prewet chamber

Economical entry to single-wafer processing

Easy scale-up path to automated production

Improved process quality and consistency

Smallest Solstice system footprint

LT3 available with vacuum pre-wet (VPW) for wetting
high aspect ratio features

Dimensions

Semi-automated single-wafer process development
with up to three chambers

The Solstice® LT is a full-featured, easy-to-use system for electroplating and surface preparation application, can process a broad range of wafer sizes down to 75mm. In addition to electroplating, the system can perform highpressure metal lift-off (MLO) spray and acid applications such as UBM etch, and more. The LT accommodates up to three chambers for manual-load, semi-automated process development, R&D, or low-volume production.
The systems use the same software and controls, and the same selection of chambers as the Solstice S4 and S8 configurations, providing an easy scale-up to automated production as capacity need expand.

The Solstice LT system chambers may be configured with a mix of different plating and surface prep chambers, including: GoldPro, CopperMax, Wet Etch, Solvent/MLO, Bevel Etch, and Gen4 Chamber.

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Let’s Talk

We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.

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  • Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
  • Markets
    • Advanced Packaging
    • Photonics
    • Artificial Intelligence
    • MEMS and Sensors
    • RF & Power Devices
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us

ClassOne Technology Inc.

109 Cooperative Way

Kalispell, Montana, 59901

United States

+1 406 407 7814