SOLSTICE

Solstice^® Max Series Single-Wafer Processing Platform

Modular Single-Wafer Processing for 200mm and 300mm Wafers

The Solstice_^® Max platform extends ClassOne’s proven single-wafer wet processing technology into a new era of modularity. Purpose-built for a broad range of wafer-level packaging (WLP) applications and fab types. Solstice Max delivers advanced electroplating and surface preparation performance with the ability to process both 200mm and 300mm wafers in the same tool. Designed from the ground up to deliver low cost of ownership (CoO), Solstice Max offers unmatched price-to-performance, process flexibility, reliability, and extraordinary modularity that grows with your production needs.

Modular, Scalable Architecture

The Solstice Max platform is precision-engineered to deliver process performance for today’s most advanced packaging requirements with exceptional flexibility:

200mm & 300mm capability in one platform – run silicon, glass, thinned, and bonded wafers of both sizes concurrently.
Modular, field-extendible design – start with a four-chamber system and add four-chamber modules, to a maximum of four modules (16 chambers), as production ramps.
Compact footprint – enables Solstice Max to be installed in a wide range of cleanroom environments and can accommodate fabs with height limitations.
Unbeatable ROI – achieve exceptional on-wafer results and throughput without unnecessary complexity.

Multiple Processes for Expanded Possibilities

Solstice Max provides a turnkey solution for electroplating, wet processing, solvent strip, and wafer cleans — allowing customers to configure unique process flows within the standard framework of the platform.

Key Applications

Solstice Max targets six key vital plating and wet surface process applications that encompass a host of capabilities:

Advanced Packaging

• High-value electroplating and support processes for advanced packaging and other back-end applications such as bumping, pillar, and multi-metal stacks.

• Enabled by high-performance, fountain-style plating chamber design, together with vacuum pre-wet, wet-etch and other wet processing chambers.

Seed & Barrier Etch

• Fast, uniform application of seed & barrier etch chemistries enabled by the wet-etch chamber with face-up SRD.

• End point detection allows for automatic recipe optimization and ongoing process validation.

Solvent Processing

• Dedicated or partial solvent tools can be configured with PR strip and metal liftoff (MLO) chambers, using both flood-soak and high-pressure swing arm, enabled by face-down architecture.

• Stainless steel chamber design that is closed and exhausted during process, allows for safe handling and use of solvent chemistries, while minimizing escape of vapors and fumes.

Back-End Cleans

• Single-wafer solvent, wet-etch and bevel-etch chambers provide the full suite of options for targeted back-end cleans.

• Solstice performs fast, efficient backside and front-side cleans at many steps within back-end processing to ensure wafer and packaging integrity.

Advanced Gold Plating

• Gold plating is the established standard for many applications, especially VCSEL and RF devices

• The ECD chamber design enables rapid deposition with excellent uniformity across device types.

• The Solstice Max platform’s chamber flexibility is ideally suited for developing and scaling new technologies – from glass and microLEDs to hybrid bonding, heterogeneous integration, and more.