Advanced Packaging

ClassOne’s Solstice is a great match for the advanced packaging market. From market leaders to new entrants in Europe and Asia, ClassOne serves these customers with its highly flexible Solstice platform. Combining advanced high-performance plating and surface-prep chambers allows both high-volume and specialty/niche packaging partners to process wafers. Our customers continue to advance processes in pillar, TSV, RDL, interposer and other emerging interconnect technologies such as hybrid bonding.

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We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.

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