Systems Designed for Advanced Microelectronics Markets

ClassOne Technology specializes in advanced electroplating and surface-preparation wet processing systems for semiconductor and compound semiconductor markets, supporting innovations in advanced packaging, VCSELs, microLEDs, MEMS, sensors, and RF/power devices.

The Solstice platform enables high-precision processes like through-silicon via (TSV), hybrid bonding, and interposers for advanced packaging, while also enabling uniform fast plating for VCSELs, microLEDs, and RF filters used in 5G communications.

With a focus on flexibility, reliability, and cost-effectiveness, ClassOne supports both volume manufacturing and R&D, delivering solutions for applications ranging from 3D sensing and micro-displays to autonomous vehicle sensors and high-frequency communications, helping customers transition from lab to fab with enhanced performance and yield.