Solstice S4
Advanced, single-wafer, high-throughput ECD and surface preparation, with up to four chambers
Key Benefits
Smaller footprint and lower cost than Solstice S8
High plating rates, excellent throughput
Exceptional quality plating and surface prep
Special processing chambers can substantially reduce
plating costs
Superior process control and excellent uniformity
Dimensions
Advanced, single-wafer, high-throughput ECD and surface preparation, with up to four chambers
The Solstice® S4 automated electroplating systems are high-speed, fully -automated, 4-chamber tool designed for electroplating as well as surface preparation wet processing. The S4 provides all the essential features and capabilities of the S8, but with fewer chambers, a smaller footprint, and a lower price. The S4 can be ideal for users with simpler processing needs or who require an economical entry point into mid-level automated single-wafer electroplating production with enhanced process control.
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