Solstice S8
Automated Electroplating Systems
Advanced, single-wafer, high-throughput ECD and Surface Preparation – with up to eight chambers
Eight chambers for maximum throughput and flexibility
The Solstice® S8 automated electroplating systems are high-speed, fully-automated, 8-chambered tool designed for electrochemical deposition (ECD) as well as surface preparation wet processing – specifically for ≤200mm wafers. It is the most powerful, easy-to-use, and cost-efficient route to single-wafer volume production for many applications.
The S8 is engineered to deliver class-leading performance and exceptional operational flexibility. Its unique platform enables it to handle a spectrum of wet processes, from electroplating to high-pressure metal lift-off to UBM etch and much more. The system is designed to accommodate many different substrate types, both transparent and opaque, from very thin to bonded.
The Solstice S8 delivers high-quality plating of a wide range of metals, from gold and copper to nickel and indium. Specialized Solstice processes and chambers can significantly reduce plating costs, especially with gold, copper and other applications.
Speed, uniformity, and control
Solstice gives wet bench users an attractive, affordable, and easy upgrade path to the benefits of high-speed, cassette-to-cassette automated processing – along with major improvements in quality, consistency, throughput, safety, and control.
The eight chambers of this system may be configured with a mix of different plating and surface prep chambers, specified at the time of purchase. All Solstice models share the same innovative high-performance chambers, software controls, and electronics. Each tool also provides the same intuitive touch-screen control, with GEM/SECSII interface, full reporting and a great deal more.
See also:
KEY FEATURES
- Eight chambers to enable many functions
- Configurable for plating and surface prep on a single tool
- Handles 75mm to 200mm substrates
- Enables rapid diameter changes
- Handles thin or bonded, transparent or opaque substrates
- Wide range of processes for Au, Cu, Ni, In, Sn, Pt, alloys & more
- Au apps include VCSEL, TWV, Thin Layer Stacks, Au deplate & more
- Cu apps include TSV, Pillar, Bump, RDL, Damascene & more
MAJOR BENEFITS
- High plating rates, excellent throughput
- Exceptional quality plating and surface prep
- Special processing chambers can substantially reduce plating costs
- Superior process control and excellent uniformity
Eight chambers for maximum throughput and flexibility
The Solstice® S8 automated electroplating systems are high-speed, fully-automated, 8-chambered tool designed for electrochemical deposition (ECD) as well as surface preparation wet processing – specifically for ≤200mm wafers. It is the most powerful, easy-to-use, and cost-efficient route to single-wafer volume production for many applications.
The S8 is engineered to deliver class-leading performance and exceptional operational flexibility. Its unique platform enables it to handle a spectrum of wet processes, from electroplating to high-pressure metal lift-off to UBM etch and much more. The system is designed to accommodate many different substrate types, both transparent and opaque, from very thin to bonded.
The Solstice S8 delivers high-quality plating of a wide range of metals, from gold and copper to nickel and indium. Specialized Solstice processes and chambers can significantly reduce plating costs, especially with gold, copper and other applications.
Speed, uniformity, and control
Solstice gives wet bench users an attractive, affordable, and easy upgrade path to the benefits of high-speed, cassette-to-cassette automated processing – along with major improvements in quality, consistency, throughput, safety, and control.
The eight chambers of this system may be configured with a mix of different plating and surface prep chambers, specified at the time of purchase. All Solstice models share the same innovative high-performance chambers, software controls, and electronics. Each tool also provides the same intuitive touch-screen control, with GEM/SECSII interface, full reporting and a great deal more.
