Technology
Papers

Advanced Semiconductor Plating – Key Fundamentals

Process Application Note #100 – This paper provides background fundamentals of electrochemical deposition (ECD) in the semiconductor industry for engineers, technicians, and other personnel involved in plating processes.  See Summary Overview

Electroplating Fundamentals – Optimizing Cross-wafer Uniformity

Process Application Note #101 – This paper presents the basic principles and methodologies for helping process engineers to achieve optimized cross-wafer uniformity in semiconductor electroplating. It provides guidance for users of different plating systems.  See Summary Overview