Solstice Process Performance Specifications

2D and 3D Wafer Level Packaging Processing

Cu RDL Cu Pillar Cu TSV Low Stress Ni
Thickness (μm) 10 40 10 5
Feature Size (μm) 5-250 20-80 5-250 (8:1 AR) 5-250
Within-Wafer Uniformity* ±5% ±5% ±5% ±5%
Wafer-to-Wafer Uniformity* ±1% ±1% ±1% ±1%
Sn Pillar AuSn Solder SnAg Solder Cn/Ni/Sn Pillar
Thickness (μm) 40 10 60 30/5/50
Feature Size (μm) 20-80 5-150 5-150 5-150
Within-Wafer Uniformity* ±5% ±5% ±5% ±5%
Wafer-to-Wafer Uniformity* ±1% ±1% ±1% ±1%

MEMS, Sensors, Power, RF, LED, Photonics, Bio

Au Thick Cu Thick Ni Indium Ag
Thickness (μm) 5 150 150 10 5
Feature Size (μm) 5-250 10-1000 10-1000 5-250 5-250
Within-Wafer Uniformity* ±5% ±5% ±5% ±5% ±5%
Wafer-to-Wafer Uniformity* ±1% ±1% ±1% ±1% ±1%

Other Solstice Processes

UBM Etch with Optical Endpoint

Solvent Spray for Resist Strip and Polymer Removal

Metal Lift-Off

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Process Articles

Trident Metal Liftoff Process

Trident SST for Metal Lift-Off Process

Inexpensively patterning metal for the fabrication of micro-devices such as MEMs, sensors, LEDs, and photonics (to name a few) is a nearly universal, but fundamental process. A common and effective method is to deposit a blanket layer of metal over a patterned release layer such as photoresist. By relying on the adhesion of the metal to the substrate, the dissolution of the underlying resist releases the unwanted metal leaving islands of patterned metal behind.

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ClassOne Technology

Wafer Level Packaging

ClassOne Technology designs and builds the Solstice Automated Plating Tool for several semiconductor process steps of the wafer-level packaging process that includes, Cu Plating, Cu RDL, Cu Pillar Plating, Cu Bump Plating, Barrier Plating, and various type of lead-free Solder Plating.

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CU Pillar Process

Solstice Plating Tool for Cu Plating (Cu RDL, Cu Bumps, Cu Pillars)

ClassOne Technology designs and builds the Solstice Plating System for several semiconductor process steps of the wafer-level packaging process that includes, Cu Plating, Cu RDL, Cu Pillar Plating, Cu Bump Plating, Barrier Plating, and various type of lead-free Solder Plating.

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