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ClassOne Places Flagship Solstice® CopperMax™ Electroplating Tool with Defense Industry Supplier i3 Microsystems, Inc. a wholly owned subsidiary of i3 Electronics, Inc (“i3”)

Kalispell, MT – August 7th, 2018, ClassOne, the premier supplier of new electroplating and wet process tools to the 200mm and smaller semiconductor manufacturing industry, today announced the sale its flagship Solstice® S8 CopperMax™ electroplating tool to i3 of Binghamton, NY.

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Top VCSEL Makers Choose ClassOne Plating Systems

Kalispell, MT – May 30, 2018 Semiconductor equipment manufacturer ClassOne Technology has announced the sale of its Solstice® Electroplating Systems to the industry’s leading providers of VCSEL (Vertical-Cavity Surface-Emitting Laser) devices in recent months.

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ClassOne Equipment Selected to Upgrade Major UK Fab

Atlanta, GA – February 27, 2018 – ClassOne Equipment, Atlanta-based provider of refurbished name-brand semiconductor processing equipment, has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab.

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ClassOne Slashes Via Liner Plating Costs for Compound Semi

Kalispell, MT – November 21, 2017 – ClassOne Technology, manufacturer of Solstice® plating systems for ≤200mm wafers, announced a new plating technique that provides significant cost reductions for compound semiconductor manufacturers who use gold plated vias.

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New Integrated Financing Streamlines Equipment Purchasing

Kalispell, MT – October 13, 2017 – ClassOne Group, provider of semiconductor processing systems, today announced a special new financing program that seeks to give more attractive options to equipment purchasers.

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ClassOne select TFE as their representative in Southern Europe

Binasco – June 30, 2017 – TFE – Thin Film Equipment Srl and ClassOne Technology, Inc. have signed an agreement that allows TFE to exclusively represent ClassOne Technology, Inc products in Southern Europe and related countries.

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New ClassOne Chamber Cuts Copper Plating Costs 95%

Kalispell, MT – March 8, 2017 – ClassOne Technology, manufacturer of budget-friendly Solstice® plating systems, announced it’s new CopperMax™ chamber — an innovative design that is demonstrating major copper plating cost reductions for users of ≤200mm wafers.

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ClassOne Signs Scientech as Rep for China, Taiwan and SE Asia

Kalispell, MT – March 8, 2017 – ClassOne Technology, manufacturer of wet processing equipment for 200mm and smaller wafers, announced that Scientech Corporation of Taipei, Taiwan, will become the company’s new representative for China, Taiwan and Southeast Asia, starting immediately.

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ClassOne Initiative Aims to Reduce CoO in ≤200mm Copper Plating

Kalispell, MT – February 22, 2017 – ClassOne Technology (, manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has just announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

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ClassOne Reports Record Sales, Crediting WLP and More than Moore

Kalispell, MT – December 6, 2016 – ClassOne Technology, manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand. “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt. “Most of these users are now focusing on capabilities they couldn’t get before, like wafer-level packaging and More than Moore technologies.”

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